Applied Materials And A*STAR's Institute Of Microelectronics To Drive Advanced 3D Chip Packaging With World-Class R&D Lab In Singapore

Last Updated: 07 March 2012
Applied Materials and AStar

From left: Professor Dim-Lee Kwong, Executive Director, IME; Mr Leo Yiip, Chairman, EDB; Dr Randhir Thakur, Executive Vice-President and General Manager, Silicon Systems Group, Applied Materials; Mr Lim Hng Kiang, Minister and Industry; Mr Michael Splinter, Chairman, President & CEO, Applied Materials; Mr Lim Chuan Poh, Chairman, A*Star

Applied Materials, Inc., the global leader in providing manufacturing solutions for the semiconductor, flat panel display and solar photovoltaic industries, and the Institute of Microelectronics (IME), a world-renowned research institute under the Agency for Science, Technology and Research (A*STAR), officially opened the Centre of Excellence in Advanced Packaging at Singapore’s Science Park II on 7 March 2012. Singapore's Minister for Trade and Industry, Mr. Lim Hng Kiang, presided at today's opening ceremony.

The Centre of Excellence in Advanced Packaging has been built with a combined investment of over USD$100 million from Applied Materials and IME. The world-class facility features a 14,000 square foot Class-10 cleanroom and is equipped with a fully-integrated line of 300 millimetre manufacturing systems to support the research and development of 3D chip packaging, a critical growth area for the semiconductor industry.

The Centre will be the most advanced lab of its kind dedicated to wafer level packaging and will combine Applied Materials' leading-edge equipment and process technology with IME’s leading research capability in 3D chip packaging. The Centre positions Singapore as a global leader in semiconductor R&D and is expected to help accelerate the development and adoption of 3D packaging technology globally.

"Today, we are not only opening the most advanced wafer level packaging lab of its kind in the world, but we are also opening a new product development capability for Applied Materials in Asia," said Mike Splinter, Chairman and Chief Executive Officer of Applied Materials. "This Centre will strengthen our ability to advance new technologies and allow us to work more closely with our customers in Asia."

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Applied Materials And A*STAR's Institute Of Microelectronics To Drive Advanced 3D Chip Packaging With World-Class R&D Lab In Singapore
Applied Materials And A*STAR's Institute Of Microelectronics To Drive Advanced 3D Chip Packaging With World-Class R&D Lab In Singapore

Applied Materials, Inc., and the Institute of Microelectronics (IME), officially opened the Centre of Excellence in Advanced Packaging at Singapore’s Science Park II today. Singapore’s Minister for Trade and Industry, Mr. Lim Hng Kiang, presided at today’s opening ceremony.

07 March 2012
Press Release & Speech


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