AST breaks ground on Singapore facility to produce high end substrates and develop advanced technologies to meet global demand

Singapore, March 14, 2024 - Advanced Substrate Technologies Pte. Ltd. (AST), a Singapore-based subsidiary of TOPPAN Holdings Inc., a Japanese pioneer in printing technologies and a leading supplier of high quality Flip Chip Ball Grid Array (FC-BGA) substrates¹, broke ground for the construction of its new factory on Pesawat Drive near Jurong Lake District, on March 14, 2024.

This factory will be the first in Singapore to manufacture high-end FC-BGA substrates used in bleeding edge semiconductor products such as Network Switches and Artificial Intelligence (AI) / Machine Learning (ML) devices. The production ramp-up is part of TOPPAN's strategic growth plan to address the increasing global and regional demand for advanced substrates and complements its main production hub in Japan.

Research and development (R&D) on advanced substrate technologies to meet the future performance demands of products for such applications also will be conducted at this facility by AST.

With a target to start production by the end of 2026, AST’s factory will implement state of the art factory automation to produce substrates of highest quality and yield. This factory, with a ~95,000 sqm floor area, will also employ over 200 high-tech engineers and skilled technicians, besides other operators, providing them with an opportunity to learn and lead in the field of FC-BGA substrate manufacturing and development.

TOPPAN will bring their most advanced substrate manufacturing know-how for implementation in AST's production lines. TOPPAN's large-body and high-layer-count substrate technology is proven in the products of several well-known large semiconductor companies worldwide. AST’s initial and key hires for FC-BGA substrate manufacturing will undergo intensive training in TOPPAN’s Niigata factories in Japan.

Broadcom Inc., a global technology leader that designs, develops, and supplies a broad range of semiconductor, enterprise software and security solutions, is also supporting the establishment of this world class manufacturing facility in Singapore.

1 An FC-BGA substrate enables the interconnection between one or more silicon dies and the system board and also between those silicon dies, through its multiple layers of high density wiring. For more information, please refer to https://www.toppan.com/en/electronics/package/fc-bga/