This press release was issued by United Microelectronics Corporation (UMC).
United Microelectronics Corporation (UMC), a leading global semiconductor foundry, today officially unveiled its new fab facility in Singapore in a grand opening ceremony. The first phase of the new facility will start volume production in 2026, bringing UMC’s total production capacity in Singapore to more than 1 million wafers annually. It will also be one of the most advanced semiconductor foundries in Singapore, manufacturing semiconductors to enable communications, Internet of Things (IoT), automotive, and AI innovations.
The ceremony was attended by Deputy Prime Minister and Minister for Trade and Industry of Singapore Gan Kim Yong, Senior Minister and Coordinating Minister for National Security of Singapore Teo Chee Hean, Permanent Secretary of Singapore’s Ministry of Trade and Industry Beh Swan Gin, Managing Director of the Singapore Economic Development Board (EDB) Jermaine Loy, and Jurong Town Corporation (JTC) Assistant Chief Executive Officer Christine Wong.
The facility, a greenfield expansion adjacent to UMC’s existing fab in the Pasir Ris Wafer Fab Park, spans two phases. Up to US$5 billion will be invested to bring the first phase to full capacity of 30,000 wafers per month, with room for further investment in a second phase expansion in the future. The new facility is equipped for manufacturing with UMC’s industry-leading 22nm and 28nm solutions – the most advanced foundry processes currently in Singapore’s semiconductor sector – for global customers’ products including premium smartphone display chips, power-efficient memory chips for IoT devices, and next-generation connectivity chips. The expansion is expected to create approximately 700 jobs locally over the next few years, including process and equipment engineers as well as research and development engineers.
