This press release was jointly issued by AEIM Pte Ltd and Polymatech Electronics Limited.
One of Singapore’s first dedicated commercial-scale LED Chip-on-Board (CoB) packaging facilities — anchoring a vertically integrated global semiconductor and advanced electronics supply chain spanning five countries across four continents.
AEIM Pte Ltd, a wholly owned subsidiary of Polymatech Electronics Limited, today announced the opening of its advanced electronics manufacturing facility at Mapletree Hi-Tech Park, 163 Kallang Way, Singapore.
Backed by a committed investment of approximately US$25 million (S$32 million), the facility serves as Polymatech’s Asia-Pacific manufacturing hub for LED Chip-on-Board (CoB) packaging, with advanced memory module assembly capability installed.
The facility is positioned as one of Singapore’s first dedicated commercial-scale LED Chip-on-Board (CoB) packaging facilities and is expected to create approximately 50 high-value engineering and manufacturing roles in Singapore over five years.
The official launch ceremony was attended by representatives from the Singapore Economic Development Board (EDB), together with AEIM technology partners from Japan, Malaysia, France, the United States, and Singapore, industry partners, and members of Singapore’s semiconductor and advanced manufacturing ecosystem.
Strengthening Singapore’s Advanced Electronics Ecosystem
The AEIM facility at Kallang Way is fully operational and equipped with advanced dispensing, packaging, curing, inspection, testing, and module assembly systems designed to support high-precision electronics manufacturing and specialised LED Chip-on-Board (CoB) packaging applications.
The facility has been developed using globally sourced manufacturing technologies and industry-leading production processes, reflecting AEIM’s commitment to quality, reliability, and operational excellence.
The Singapore facility houses two complementary manufacturing capabilities:
- LED Chip-on-Board (CoB) Packaging — producing UV, IR, and full-spectrum LED CoB products for horticulture, medical, industrial inspection, and specialised OEM applications.
- Advanced Memory Module Assembly Capability — installed to support high-performance computing, enterprise systems, industrial electronics, and embedded technology applications.
The facility strengthens Singapore’s advanced manufacturing ecosystem by adding specialised opto-electronics packaging and advanced electronics assembly capabilities to the nation’s semiconductor value chain.
From India to the World — Via Singapore
Founded in Chennai, India on 29 May 2007, Polymatech Electronics Limited is currently in its 20th year of operations and innovation, having successfully completed 19 years of growth in semiconductor packaging, opto-electronics, and advanced electronics manufacturing.
Operating from SIPCOT Hi-Tech SEZ, Oragadam, the company has evolved into a globally oriented advanced semiconductor packaging and opto-electronics manufacturer serving customers across Asia, Europe, and North America. Over nearly two decades, Polymatech has steadily expanded its technological capabilities, international partnerships, and manufacturing footprint, laying the foundation for its transformation into an internationally integrated semiconductor and advanced electronics enterprise.
As Polymatech’s product portfolio and customer base expanded globally, the company recognised the strategic need for an Asia-Pacific manufacturing and operations hub capable of serving international markets with greater speed, supply-chain resilience, and proximity to global semiconductor ecosystems.
Singapore emerged as the natural choice for the company’s international expansion. Its strategic location at the centre of Asia’s semiconductor ecosystem, world-class logistics and connectivity infrastructure, trusted regulatory and intellectual property framework, strong support ecosystem for advanced manufacturing, and access to highly skilled engineering talent made it an ideal base for international growth.
