Toh Li Ying is a Senior Manager at United Microelectronics Corporation (UMC), a leading global semiconductor foundry headquartered in Hsinchu, Taiwan. UMC established its first advanced fabrication plant in Singapore in 2000, and later designated its Singapore site to spearhead research and development for specialty process technologies. In 2025, the company unveiled a new wafer plant here, which will create 700 new jobs and bring UMC’s total production capacity in Singapore to over 1 million wafers annually. Today, Singapore is also home to one of UMC’s largest R&D teams outside of Taiwan, reflecting the company’s long-term commitment to growing Singapore’s semiconductor ecosystem.
1. Tell us more about what you do at United Microelectronics Corporation (UMC).
At UMC Singapore, I lead the Defect Management team, which ensures the quality of wafers that go into the electronic devices we use every day. In simple terms, my job is to minimise defects in the chips we manufacture. This is done through automated inspection systems and advanced data analytics, which we use to detect and resolve issues quickly.
As chip features get smaller, even the tiniest defect can have a big impact on yield and product quality, making defect management more challenging. As every new technology platform introduces new process complexities and defect types, my team and I continuously improve our processes so we can deliver products that meet the highest industry standards.