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Covestro announces regional application centre in Singapore

Covestro announces regional application centre in Singapore


Covestro announces regional application centre in Singapore

Covestro announces regional application centre in Singapore - Photo Credit: Covestro

On 24 April 2018, German high-tech polymer materials company Covestro announced that it has joined forces with an international group of companies to launch the Composite Application Centre (CAC) in Singapore. The centre aims to drive the development of advanced composites in anticipation of higher demand for stronger and lighter products. The memorandum of understanding was signed at the Germany-Singapore Business Forum held at Hannover Messe, the world’s largest industrial fair. The group is spearheaded by Composite Cluster Singapore.

The centre begins operations on 01 May and will provide a platform for customer trials, prototyping, pilot manufacturing, training and support services. Dr Florian Doetzer, Managing Director of Composite Cluster Singapore shared that the establishment of CAC was made in response to request of the composites industry to bring together all partners of the value chain to develop end-to end solutions.

Product companies can tap into CAC’s combined expertise and facilities to reduce the initial investments and risk for composite-related product design and manufacturing, said Covestro. The company will also work with international leaders in composite research, and regional education and training centres. Such composites are in demand in the electronics industry, which wants stronger and lighter materials to produce thinner parts, as well as in other segments such as automotive businesses, household appliance manufacturers and producers of sports goods and shoes.

Miss Cindy Koh, Director of Energy & Chemicals at EDB, said that Singapore's strong fundamentals in manufacturing, coupled with its investments in technology, are enabling the country to anchor new activities in new and growing areas such as composites.

Press Release

24 April 2018

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